US 12,261,072 B2
Substrate test apparatus and method for measuring dechucking force using the same
Jong Ho Kim, Gyeonggi-do (KR); Doo Hee Lee, Daegu (KR); and Hae Yong Ryu, Gyeonggi-do (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Chungcheongnam-do (KR)
Filed on Aug. 18, 2022, as Appl. No. 17/890,987.
Claims priority of application No. 10-2021-0145982 (KR), filed on Oct. 28, 2021.
Prior Publication US 2023/0140544 A1, May 4, 2023
Int. Cl. H01L 21/683 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32715 (2013.01); H01J 37/32935 (2013.01); H01L 21/68721 (2013.01); H01J 2237/0048 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate test apparatus, comprising:
an electrostatic chuck configured to support a substrate;
a normal-force measuring unit disposed on the electrostatic chuck;
an electrostatic-chuck power supplying unit configured to apply a driving voltage and a first ground voltage to the electrostatic chuck; and
a substrate power supplying unit configured to apply a second ground voltage to the substrate,
wherein the substrate test apparatus is configured to perform steps comprising:
applying the driving voltage to the electrostatic chuck, and charging the substrate by applying the second ground voltage to the substrate;
subsequently discharging the substrate by applying the first ground voltage to the electrostatic chuck and by applying the second ground voltage to the substrate; and
subsequently measuring a dechucking force of the substrate by the normal-force measuring unit.