| CPC H01L 21/681 (2013.01) [H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/67259 (2013.01); H01L 24/75 (2013.01); H01L 21/67017 (2013.01); H01L 21/68707 (2013.01); H01L 2224/75753 (2013.01)] | 8 Claims |
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1. A component mounting method for mounting, on a substrate having a plurality of first alignment marks disposed in a region in which one component is mounted within a mounting surface on which at least said one component is mounted, a component having a plurality of second alignment marks corresponding to the plurality of first alignment marks disposed, the component mounting method comprising:
a first imaging step of imaging the plurality of first alignment marks and the plurality of second alignment marks, using an imaging device at same time with the plurality of first alignment marks and the plurality of second alignment marks separated from each other by a preset first distance at which the plurality of first alignment marks and the plurality of second alignment marks fall within a depth-of-field range of the imaging device;
a first step of calculating amount of positional deviation of calculating a relative positional deviation amount between the substrate and the component from an imaged image of the plurality of first alignment marks and the plurality of second alignment marks imaged by the imaging device, with the substrate and the component separated from each other by the first distance;
a first position correction step of, by relatively moving the component with respect to the substrate in a direction that is parallel with the mounting surface and in which the positional deviation amount decreases, based on the positional deviation amount calculated in the first step of calculating amount of positional deviation, correcting a relative position of the component with respect to the substrate;
a second imaging step of imaging the plurality of first alignment marks and the plurality of second alignment marks, using the imaging device with the substrate and the component separated from each other by a preset second distance longer than the first distance after the component has been transferred to a head for holding the component;
a second step of calculating amount of positional deviation of calculating a relative positional deviation amount between the substrate and the component from an imaged image of the plurality of first alignment marks and the plurality of second alignment marks imaged by the imaging device with the substrate and the component separated from each other by the second distance;
a second position correction step of relatively moving the component with respect to the substrate in a direction that is parallel with the mounting surface and in which the positional deviation amount decreases, based on the positional deviation amount calculated in the second step of calculating amount of positional deviation; and
a movement step of relatively bringing the component close to the substrate until the substrate and the component reach a state of being separated from each other by a preset first distance.
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