US 12,261,069 B2
Multiple semiconductor die container load port
Chih-Hung Huang, Hsinchu (TW); Cheng-Lung Wu, Zhunan Township (TW); Yi-Fam Shiu, Toufen (TW); Yu-Chen Chen, Hemei Township (TW); Yang-Ann Chu, Hsinchu (TW); and Jiun-Rong Pai, Jhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 19, 2024, as Appl. No. 18/417,370.
Application 18/417,370 is a continuation of application No. 17/647,367, filed on Jan. 7, 2022, granted, now 12,119,251.
Application 17/647,367 is a continuation of application No. 16/912,991, filed on Jun. 26, 2020, granted, now 11,222,802, issued on Jan. 11, 2022.
Prior Publication US 2024/0162071 A1, May 16, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/677 (2006.01); B23Q 15/00 (2006.01); B23Q 16/00 (2006.01); G05D 5/04 (2006.01); H01L 23/04 (2006.01)
CPC H01L 21/6773 (2013.01) [B23Q 15/00 (2013.01); B23Q 16/00 (2013.01); G05D 5/04 (2013.01); H01L 21/67736 (2013.01); H01L 21/67778 (2013.01); H01L 23/04 (2013.01)] 20 Claims
OG exemplary drawing
 
16. A load port, comprising:
an elevator;
a housing that includes a single opening that houses the elevator; and
a stage configured to move within the single opening via the elevator, the stage comprising:
a first portion configured to support a first die container type, and
a second portion configured to support a second die container type,
wherein the elevator is configured to move the first portion within the single opening when a die container on the stage is the first die container type, and
wherein the elevator is configured to move the first portion and the second portion within the single opening when the die container on the stage is the second die container type.