US 12,261,068 B2
Wafer support member and method of manufacturing a wafer support member
Peter Davison, Puyallup, WA (US); and Paul Gwin, Orangevale, CA (US)
Assigned to INTEL CORPORATION, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 27, 2022, as Appl. No. 17/974,576.
Prior Publication US 2024/0145282 A1, May 2, 2024
Int. Cl. H01L 21/673 (2006.01)
CPC H01L 21/6732 (2013.01) 20 Claims
OG exemplary drawing
 
1. A wafer support member comprising:
a support column; and
a plurality of wafer-engagement-shelves extending substantially perpendicularly to the support column from a first side of the support column,
wherein each wafer-engagement-shelf defines a plurality of through-holes extending between a base surface and an opposite wafer-engagement surface of the wafer-engagement shelf, wherein the plurality of through-holes serve as discharge ports for a plurality of loose particulates on the wafer-engagement-shelf to exit therefrom via the discharge ports,
wherein the support column further defines a plurality of drain holes extending between the first side and an opposite second side of the support column for a fluid on the wafer-engagement-shelves to drain away therefrom via the plurality of drain holes.