US 12,261,067 B2
Wafer cleaning apparatus and wafer transfer device
Hongshuai Ma, Beijing (CN); Hongyu Zhao, Beijing (CN); and Ruiting Wang, Beijing (CN)
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Appl. No. 18/574,817
Filed by BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
PCT Filed Jun. 23, 2022, PCT No. PCT/CN2022/100693
§ 371(c)(1), (2) Date Dec. 28, 2023,
PCT Pub. No. WO2023/274008, PCT Pub. Date Jan. 5, 2023.
Claims priority of application No. 202110730089.7 (CN), filed on Jun. 29, 2021.
Prior Publication US 2024/0420977 A1, Dec. 19, 2024
Int. Cl. H01L 21/67 (2006.01); H01L 21/673 (2006.01)
CPC H01L 21/67309 (2013.01) [H01L 21/67346 (2013.01); H01L 21/67028 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A wafer transfer device of a wafer cleaning apparatus, comprising:
a machine bracket;
a drive mechanism arranged at the machine bracket;
a retractable bracket arranged at the machine bracket including a sleeve, a first end of the retractable bracket being fixedly connected to the machine bracket, a second end of the retractable bracket being movably arranged at the machine bracket; and
a plurality of wafer support brackets arranged at the retractable bracket and arranged in a movement direction of the second end, each wafer support bracket of the plurality of wafer support brackets including a bracket pin and a shaft sleeve;
wherein:
the drive mechanism is connected to the retractable bracket and configured to drive the second end to move to cause the retractable bracket to extend and retract;
a distance of any two neighboring wafer support brackets changes as the retractable bracket extends and retracts, and the distance of any two neighboring wafer support brackets is same;
the bracket pin is arranged at a bottom of the wafer support bracket;
the shaft sleeve is rotatably connected to the bracket pin; and
the sleeve is connected to the shaft sleeve.