US 12,261,063 B2
Method and device for producing a housing
Andreas Grassmann, Regensburg (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Mar. 3, 2022, as Appl. No. 17/685,870.
Claims priority of application No. 21160985 (EP), filed on Mar. 5, 2021.
Prior Publication US 2022/0285178 A1, Sep. 8, 2022
Int. Cl. H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01)
CPC H01L 21/67126 (2013.01) [H01L 21/565 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15322 (2013.01); H01L 2924/1616 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/182 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A device for forming a housing for a power semiconductor module arrangement comprises a mold, wherein the mold comprises:
a first cavity comprising a plurality of first openings and a second opening, the second opening being coupled to a runner system, wherein the runner system is configured to inject a mold material into the first cavity through the second opening;
a plurality of sleeves or hollow bushings, wherein a first end of each of the plurality of sleeves or hollow bushings is arranged in one of the first openings, and wherein a second end of each of the plurality of sleeves or hollow bushings extends to the outside of the mold;
a heating element configured to heat the mold; and
a cooling element configured to cool the plurality of sleeves or hollow bushings.