US 12,261,060 B2
Substrate processing apparatus and stage cleaning method
Tsutomu Hiroki, Nirasaki (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Sep. 22, 2020, as Appl. No. 17/028,702.
Claims priority of application No. 2019-177480 (JP), filed on Sep. 27, 2019.
Prior Publication US 2021/0098269 A1, Apr. 1, 2021
Int. Cl. H01L 21/67 (2006.01); C23C 16/44 (2006.01); C23C 16/458 (2006.01); H01J 37/32 (2006.01); H01L 21/285 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67023 (2013.01) [C23C 16/4401 (2013.01); H01J 37/32862 (2013.01); H01L 21/28562 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01); H01L 21/68714 (2013.01); C23C 16/4586 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a stage on which a target substrate is placed;
a liquid supply unit configured to supply liquid for heating the target substrate into a first temperature range to the stage, the liquid supply unit comprising:
a low temperature liquid supply unit configured to supply the liquid adjusted to a first predetermined temperature; and
a high temperature liquid supply unit that is distinct from the low temperature liquid supply unit, the high temperature liquid supply unit configured to supply the liquid adjusted to a second predetermined temperature that is greater than the first predetermined temperature;
a low temperature liquid supply path having a first end connected to the low temperature liquid supply unit;
a high temperature liquid supply path having a first end connected to the high temperature liquid supply unit;
a valve unit connected to a second end of the low temperature liquid supply path and a second end of the high temperature liquid supply path, the valve unit comprising a switching mechanism inside the valve unit and configured to control a supply ratio of the liquid supplied through the low temperature liquid supply path and the liquid supplied through the high temperature liquid supply path:
a flow path formed in the stage and through which the liquid supplied from the valve unit flows;
a heater configured to heat the stage to a second temperature higher than the first temperature range to remove deposits adhered to the stage;
a gas supply unit connected to the high temperature liquid supply path and configured to supply a gas to the flow path; and
a controller,
wherein the controller is configured to switch a fluid in the flow path from the liquid supplied from the liquid supply unit to the gas supplied from the gas supply unit, and to control the heater to heat the stage to the second temperature after replacement of the fluid in the flow path with the gas, and
wherein the controller is configured to use the gas to push the liquid in the flow path into the low temperature liquid supply unit of the liquid supply unit which is configured to receive the liquid and gas discharged from the flow path, and further comprises a tank for performing gas-liquid separation of the discharged liquid and gas.