US 12,260,994 B2
Composite electronic component with electrode using epoxy
Kyung Moon Jung, Suwon-si (KR); Seong Hwan Park, Suwon-si (KR); and Sung Jun Lim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Apr. 12, 2022, as Appl. No. 17/718,723.
Claims priority of application No. 10-2021-0154817 (KR), filed on Nov. 11, 2021.
Prior Publication US 2023/0141373 A1, May 11, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/232 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/2325 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A composite electronic component comprising:
a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode through a surface of the body; and
an interposer including a substrate, disposed below the body in a first direction, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member, wherein:
the external electrode includes a first electrode layer disposed directly on a lower surface of the body and including metal particles and an insulating resin, and a third electrode layer connected to the internal electrode, the third electrode layer disposed on a side surface and an upper surface of the body and including a conductive material and glass,
a coefficient of thermal expansion of the substrate is lower than that of the dielectric layer, and
the internal electrode includes a plurality of first and second internal electrodes alternately laminated in a second direction perpendicular to the first direction.