US 12,260,970 B2
Communication cable
Yuta Yasuyoshi, Mie (JP); and Tatsuya Shimada, Mie (JP)
Assigned to AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
Appl. No. 18/269,212
Filed by AUTONETWORKS TECHNOLOGIES, LTD., Mie (JP); SUMITOMO WIRING SYSTEMS, LTD., Mie (JP); and SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka (JP)
PCT Filed Dec. 22, 2021, PCT No. PCT/JP2021/047520
§ 371(c)(1), (2) Date Jun. 22, 2023,
PCT Pub. No. WO2022/138704, PCT Pub. Date Jun. 30, 2022.
Claims priority of application No. 2020-214860 (JP), filed on Dec. 24, 2020.
Prior Publication US 2024/0047101 A1, Feb. 8, 2024
Int. Cl. H01B 11/00 (2006.01); H01B 7/29 (2006.01); H01B 11/18 (2006.01)
CPC H01B 11/1869 (2013.01) [H01B 7/292 (2013.01); H01B 11/1813 (2013.01); H01B 11/1817 (2013.01); H01B 11/1878 (2013.01); H01B 11/1895 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A communication cable, comprising:
a conductor;
an insulation layer containing an organic polymer, the insulation layer covering an outer periphery of the conductor;
a metal foil for covering an outer periphery of the insulation layer; and
a magnetic sheath layer containing an organic polymer and a powdered magnetic material, the magnetic sheath layer covering an outer periphery of the metal foil,
a tensile modulus of elasticity of the magnetic sheath layer being lower than that of the insulation layer, and
assuming that an organic polymer having a melting point of 100° C. or lower is a low melting point polymer and a mass ratio of the low melting point polymer to organic polymer components constituting each layer is a low melting point component ratio, the low melting point component ratio being larger in the magnetic sheath layer than in the insulation layer.