US 12,260,968 B2
Electrically conductive composite with co-cured region for interface surfaces
Nathan D. Hansen, Fairfax, VA (US)
Filed by CONDUCTIVE COMPOSITES COMPANY IP, LLC, Heber City, UT (US)
Filed on Nov. 18, 2022, as Appl. No. 17/990,648.
Claims priority of provisional application 63/283,281, filed on Nov. 25, 2021.
Prior Publication US 2023/0162881 A1, May 25, 2023
Int. Cl. H01B 1/02 (2006.01); B32B 3/08 (2006.01); B32B 5/02 (2006.01); B32B 15/02 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01)
CPC H01B 1/02 (2013.01) [B32B 3/08 (2013.01); B32B 15/02 (2013.01); B32B 15/20 (2013.01); B32B 5/02 (2013.01); B32B 15/14 (2013.01); B32B 2255/02 (2013.01); B32B 2255/205 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); B32B 2307/202 (2013.01); B32B 2581/00 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A conductive composite structure comprising:
a plurality of layers bound together as a laminate by curing a resin, the laminate comprising:
a composite layer infused with the resin; and
a conductive gasket layer infused with the resin, wherein at least a portion of the resin infused into the conductive gasket layer is directly connected to the composite layer as part of the plurality of layers to define a conductive interface region having a conductive interface surface, wherein the conductive gasket layer comprises a metal mesh layer partially infused with resin such that the partially infused metal mesh layer is somewhat compressible at the conductive interface surface.