US 12,260,808 B2
Transparent display module and apparatus with micro-pixel packages mounted on transparent substrate
Seungryong Han, Suwon-si (KR); Jaeseok Kim, Suwon-si (KR); Jaehoo Park, Suwon-si (KR); Sangkyun Im, Suwon-si (KR); and Kilsoo Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 24, 2023, as Appl. No. 18/114,017.
Application 18/114,017 is a continuation of application No. PCT/KR2023/001096, filed on Jan. 25, 2023.
Claims priority of application No. 10-2022-0053791 (KR), filed on Apr. 29, 2022; and application No. 10-2022-0095048 (KR), filed on Jul. 29, 2022.
Prior Publication US 2023/0351946 A1, Nov. 2, 2023
Int. Cl. G09G 3/32 (2016.01); G09F 9/302 (2006.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01)
CPC G09G 3/32 (2013.01) [G09F 9/3026 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); G09G 2310/0267 (2013.01); G09G 2310/0275 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A transparent display module, comprising:
a transparent substrate;
a line pattern provided on the transparent substrate in a form of a two-dimensional grid;
a plurality of micro-pixel packages, each micro-pixel package comprising a relay substrate, at least one micro-pixel integrated circuit (IC) provided on the line pattern and a plurality of inorganic light emitting elements provided on the at least one micro-pixel IC in which:
the plurality of inorganic light emitting elements are provided on a first surface of the relay substrate and the at least one micro-pixel IC is provided on a second surface of the relay substrate that is opposite to the first surface of the relay substrate, and
a plurality of transparent areas formed in areas in which the line pattern is not provided,
wherein the at least one micro-pixel IC includes at least one pixel circuit configured to supply a driving current to the plurality of inorganic light emitting elements,
wherein the plurality of micro-pixel packages are electrically connected to the transparent substrate by solder balls,
wherein a height of each of the solder balls is greater than a height of the at least one micro-pixel IC such that the at least one micro-pixel IC is not in contact with the transparent substrate
wherein the each micro-pixel package comprises:
an upper wiring provided on the first surface of the relay substrate and extending from the plurality of inorganic light emitting elements;
a lower wiring provided on the second surface of the relay substrate and extending from the at least one macro-pixel IC:
an upper connection pad provided on an edge of the first surface of the relay substrate,
a lower connection pad provided on an edge of the second surface of the relay substrate; and
wherein the plurality of inorganic light emitting elements provided on the first surface of the relay substrate are electrically connected to the at least one micro-pixel IC provided on the surface of the relay substrate through the upper wiring, the upper connection pad, the side wiring, the lower connection pad, and the lower wiring.