US 12,260,669 B2
Fingerprint sensor in InFO structure and formation method
Chih-Hua Chen, Zhubei (TW); Yu-Feng Chen, Hsinchu (TW); Chung-Shi Liu, Hsinchu (TW); Chen-Hua Yu, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); and Yu-Chih Huang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 7, 2023, as Appl. No. 18/348,460.
Application 18/348,460 is a continuation of application No. 17/320,639, filed on May 14, 2021, granted, now 11,741,737.
Application 17/320,639 is a continuation of application No. 16/511,721, filed on Jul. 15, 2019, granted, now 11,010,580, issued on May 18, 2021.
Application 16/511,721 is a continuation of application No. 15/254,357, filed on Sep. 1, 2016, granted, now 10,354,114, issued on Jul. 16, 2019.
Claims priority of provisional application 62/349,355, filed on Jun. 13, 2016.
Prior Publication US 2023/0360426 A1, Nov. 9, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06V 40/13 (2022.01); H01L 21/56 (2006.01)
CPC G06V 40/1306 (2022.01) [G06V 40/1329 (2022.01); H01L 21/568 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/19 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a sensor die;
a molding compound encapsulating the sensor die therein, wherein a first top surface of the molding compound is substantially coplanar with or higher than a second top surface of the sensor die; and
a first plurality of sensing electrodes over and electrically coupling to the sensor die, wherein the first plurality of sensing electrodes are arranged as a plurality of rows and columns, and wherein the first plurality of sensing electrodes comprise:
a first portion of the first plurality of sensing electrodes overlapping the sensor die; and
a second portion of the first plurality of sensing electrodes overlapping the molding compound.