US 12,260,541 B2
Soldering quality inspection method and soldering quality inspection apparatus
Shang-En Wu, Tainan (TW); Keng-Chi Liang, Kaohsiung (TW); Kuang-Tse Ho, Hsinchu County (TW); and Hung-Jen Chen, Hsinchu (TW)
Assigned to MATERIALS ANALYSIS TECHNOLOGY INC., Hsinchu County (TW)
Filed by Materials Analysis Technology Inc., Hsinchu County (TW)
Filed on Jun. 29, 2022, as Appl. No. 17/853,859.
Claims priority of application No. 110126717 (TW), filed on Jul. 21, 2021.
Prior Publication US 2023/0029432 A1, Jan. 26, 2023
Int. Cl. G06T 7/00 (2017.01); G06T 7/11 (2017.01)
CPC G06T 7/0008 (2013.01) [G06T 7/11 (2017.01); G06T 2207/30152 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A soldering quality inspection method for inspecting a soldering quality of a position under inspection of an assembly under inspection, wherein the assembly under inspection is formed by an electronic assembly being immersed in a dye ink, drying the electronic assembly, and removing an electronic element of the electronic assembly; wherein the electronic assembly includes a substrate and the electronic element, the substrate has at least one soldering pad disposed thereon, the at least one soldering pad is connected with the electronic element through a soldering structure, and a position on the substrate for placement of the at least one soldering pad is defined as the position under inspection; wherein the soldering quality inspection method comprises:
an image acquisition step for acquiring an inspection image that includes at least one soldering region, wherein the at least one soldering region is an image that corresponds to the position under inspection; and
a percentage calculating and quality determining step for calculating, by a processing device, a dyed area percentage of an area of a part of the at least one soldering region that is dyed by the dye ink relative to an area of the at least one soldering region, and determining, by the processing device, whether or not the dyed area percentage is greater than a predetermined dyed percentage;
wherein, when the processing device determines that the dyed area percentage is equal to or less than the predetermined dyed percentage, the processing device determines that the position under inspection is of good soldering quality and generates a corresponding inspection result information;
wherein, when the processing device determines that the dyed area percentage is greater than the predetermined dyed percentage, the processing device determines that the position under inspection is of poor soldering quality and generates the corresponding inspection result information;
wherein the image acquisition step and the percentage calculating and quality determining step further have a soldering structure determining step in between, and the soldering structure determining step includes: determining, by the processing device, whether or not a soldering structure image is present in the at least one soldering region; wherein the soldering structure image is an image that corresponds to the soldering structure on the substrate;
wherein, when the processing device determines that the soldering structure image is not present in the at least one soldering region, the processing device then determines that a gap is present between the at least one soldering pad and the substrate and that the position under inspection is of poor soldering quality, and generates the corresponding inspection result information, so that the processing device does not perform the percentage calculating and quality determining step;
wherein, when the processing device determines that the soldering structure image is present in the at least one soldering region, the processing device then performs the percentage calculating and quality determining step.