US 12,260,296 B1
Diamondoid materials in quantum computing devices
David J. Michalak, Portland, OR (US); James Munro Blackwell, Portland, OR (US); John J. Plombon, Portland, OR (US); and James S. Clarke, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 16, 2020, as Appl. No. 17/124,347.
Int. Cl. G06N 10/40 (2022.01); C07C 13/615 (2006.01); H03K 19/195 (2006.01); H10N 60/12 (2023.01); H10N 60/80 (2023.01); H10N 69/00 (2023.01)
CPC G06N 10/40 (2022.01) [C07C 13/615 (2013.01); C07C 2603/74 (2017.05); H03K 19/195 (2013.01); H10N 60/12 (2023.02); H10N 60/805 (2023.02); H10N 69/00 (2023.02)] 20 Claims
OG exemplary drawing
 
1. A quantum computing device, comprising:
qubit circuitry;
an interconnect in conductive contact with the qubit circuitry; and
a dielectric material proximate to the interconnect, wherein the dielectric material includes a diamondoid film.