US 12,260,278 B2
Card-type medium and card-type medium manufacturing method
Eriko Uehara, Tokyo (JP); Yukiko Katano, Tokyo (JP); and Shigeki Minemura, Tokyo (JP)
Assigned to TOPPAN INC., Tokyo (JP)
Filed by TOPPAN INC., Tokyo (JP)
Filed on Jul. 12, 2023, as Appl. No. 18/221,279.
Application 18/221,279 is a continuation of application No. PCT/JP2021/038130, filed on Oct. 14, 2021.
Claims priority of application No. 2021-004389 (JP), filed on Jan. 14, 2021.
Prior Publication US 2023/0359857 A1, Nov. 9, 2023
Int. Cl. G06K 19/077 (2006.01); G06K 19/07 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01)
CPC G06K 19/07745 (2013.01) [G06K 19/0718 (2013.01); G06K 19/07743 (2013.01); H05K 1/09 (2013.01); H05K 1/186 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A card-type medium, comprising:
a card body;
an exposed component that is accommodated inside an opening formed in a front surface of the card body and is disposed so as to be partially exposed on the front surface; and
a circuit board that is embedded in the card body and to which the exposed component is attached, wherein
the exposed component includes a first exposed component that is attached to the circuit board with an intermediate spacer interposed therebetween,
the first exposed component and the intermediate spacer are joined together by a first conductive joining material,
each of the first exposed component and the intermediate spacer comprises glass epoxy;
the circuit board and the intermediate spacer are joined together by a second conductive joining material, and,
a difference between a joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material is 20° C. or higher.