US 12,260,276 B2
IC tag and manufacturing method
Toshiharu Shimai, Yamatokooriyama (JP); Hayato Tomita, Yamatokooriyama (JP); and Yoshihiro Miyagi, Yamatokooriyama (JP)
Assigned to NITTA CORPORATION, Osaka (JP)
Appl. No. 18/010,184
Filed by NITTA CORPORATION, Osaka (JP)
PCT Filed Apr. 28, 2021, PCT No. PCT/JP2021/017119
§ 371(c)(1), (2) Date Jan. 5, 2023,
PCT Pub. No. WO2021/221141, PCT Pub. Date Nov. 4, 2021.
Claims priority of application No. 2020-080052 (JP), filed on Apr. 30, 2020; and application No. 2020-113657 (JP), filed on Jun. 30, 2020.
Prior Publication US 2023/0237302 A1, Jul. 27, 2023
Int. Cl. G06K 19/077 (2006.01)
CPC G06K 19/07728 (2013.01) [G06K 19/07758 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An IC tag comprising:
a base sheet having a first surface and a second surface;
an IC chip arranged on the first surface of the base sheet;
an antenna that is arranged on the first surface of the base sheet and is configured to electrically transmit and receive information stored in the IC chip; and
a protective sheet that is fixed to the first surface of the base sheet via a bonding agent, so as to cover the IC chip and the antenna,
wherein the protective sheet has a protruding portion that protrudes upwardly from a top surface of the protective sheet in a thickness direction along the IC chip.