US 12,260,049 B2
Touch light-emitting module having hallowed portion for incapsulation resin and manufacturing method thereof
Yi-Wen Chen, New Taipei (TW); Wen-Chung Chou, New Taipei (TW); and I-Hsin Tung, New Taipei (TW)
Assigned to LIGITEK ELECTRONICS CO., LTD., New Taipei (TW)
Filed by LIGITEK ELECTRONICS CO., LTD., New Taipei (TW)
Filed on Jan. 29, 2024, as Appl. No. 18/425,534.
Application 18/425,534 is a continuation of application No. 18/315,944, filed on May 11, 2023, granted, now 12,008,202.
Claims priority of provisional application 63/341,041, filed on May 12, 2022.
Prior Publication US 2024/0168590 A1, May 23, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/042 (2006.01)
CPC G06F 3/0421 (2013.01) [G06F 2203/04103 (2013.01); G06F 2203/04108 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A touch light-emitting module, comprising:
a printed circuit board, the printed circuit board having a top surface on which a touch-control integrated circuit (IC) and at least one luminous unit in electrical connection with the touch-control IC are disposed;
a touch-control conductor, which is combined with the printed circuit board through a conductive material, the touch-control conductor being formed with a hollowed portion in which the touch-control IC and the luminous unit are located, the hollowed portion receiving an encapsulation resin to inject therein to form encapsulation of the touch light-emitting module; and
an upper cover, the upper cover being mounted at the top of the touch-control conductor and electrically connected with the touch-control conductor, the upper cover being formed with a through-hole, the through-hole communicating with the hollowed portion of the touch-control conductor.