US 12,259,709 B2
Semiconductor manufacturing system, behavior recognition device and semiconductor manufacturing method
Kai-Ting Yang, Taichung (TW); Li-Jen Ko, Hsinchu County (TW); and Hsiang Yin Shen, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Nov. 23, 2023, as Appl. No. 18/518,464.
Application 18/518,464 is a continuation of application No. 16/996,832, filed on Aug. 18, 2020, granted, now 11,860,607.
Prior Publication US 2024/0094705 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G05B 19/4099 (2006.01); H01L 21/67 (2006.01)
CPC G05B 19/4099 (2013.01) [G05B 2219/45031 (2013.01); H01L 21/67155 (2013.01); H01L 21/67276 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing system, comprising:
at least one semiconductor manufacturing apparatus, comprising:
a series of manufacturing units configured to perform manufacturing operations on wafers;
a first control unit configured to control the manufacturing operations of the series of manufacturing units, and generate log data recording the manufacturing operations of the series of manufacturing units; and
a first storage device cooperatively connected to the first control unit and configured to store the log data transferred from the first control unit; and
a behavior recognition device cooperatively connected to the semiconductor manufacturing apparatus, the behavior recognition device comprising:
a second storage device cooperatively connected to the first control unit of the semiconductor manufacturing apparatus, and configured to store the log data transferred from the first control unit; and
a second control unit cooperatively connected to the second storage device, and configured to receive the log data from the second storage device and build a transition state model to analyze behaviors related to the manufacturing operations of the series of manufacturing units based on the log data;
wherein the behavior recognition device is further configured to reproduce an abnormal behavior of the behaviors by performing a simulation based on the transition state model, and adjust a control rule of the manufacturing units according to the reproduced abnormal behavior; and the semiconductor manufacturing apparatus is configured to manufacture a plurality of processed wafers according to the adjusted control rule.