US 12,259,660 B2
Inspection method and inspection platform for lithography
Cheng-Hsien Chen, Taoyuan (TW); Shu-Chun Liao, Hsinchu (TW); Shau-Wei Hsu, Hsinchu County (TW); Wei-En Fu, Taoyuan (TW); Tsung-Ying Chung, Hsinchu (TW); and Yi-Chen Chuang, Taipei (TW)
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed by INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed on Feb. 21, 2022, as Appl. No. 17/676,534.
Claims priority of provisional application 63/272,085, filed on Oct. 26, 2021.
Claims priority of application No. 110144747 (TW), filed on Dec. 1, 2021.
Prior Publication US 2023/0131662 A1, Apr. 27, 2023
Int. Cl. G03F 7/00 (2006.01); G01J 1/42 (2006.01)
CPC G03F 7/70591 (2013.01) [G01J 1/429 (2013.01); G01J 2001/4247 (2013.01)] 27 Claims
OG exemplary drawing
 
1. An inspection method, applicable for inspecting a light source used to expose a substrate, the light source adapted to form an illuminated area on a surface of the substrate, the inspection method comprising:
placing at least one inspection component on the surface of the substrate;
causing the at least one inspection component and the illuminated area to have a relative movement and a relative speed in a specific direction so as to make the illuminated area move across the at least one inspection component, wherein in the specific direction, the illuminated area is smaller in size than the at least one inspection component;
inspecting photon energy of incident light in the illuminated area by the at least one inspection component during the relative movement; and
determining optical values of the light source according to the photon energy and the relative speed.