| CPC G03F 7/705 (2013.01) [G06T 7/001 (2013.01); G06V 10/754 (2022.01); G06V 10/764 (2022.01); G06V 10/82 (2022.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01); G06V 10/247 (2022.01)] | 15 Claims |

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1. An inspection tool comprising:
an imaging system configured to capture an image of a portion of a semiconductor substrate; and
an image analysis system configured to reduce distortion in an image captured by the imaging system by determining an optimized weighting of a network comprising an encoder and a decoder, wherein the image analysis system is configured to:
for each of a plurality of test weightings, perform the following steps with the encoder and decoder operating using the test weighting:
(a) encoding, using the encoder, a reference image and a distorted image into a latent space to form an encoding;
(b) decoding the encoding, using the decoder, to form a distortion map indicative of a difference between the reference image and a distorted image;
(c) spatially transforming the distorted image by the distortion map to obtain an aligned image;
(d) comparing the aligned image to the reference image to obtain a similarity metric; and
(e) determining a loss function which is at least partially defined by the similarity metric;
wherein the optimized weighting is determined to be the test weighting which has an optimized loss function.
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