providing a membrane wafer on a substrate;

providing at least one thin-film on said membrane wafer wherein portions of said membrane wafer are exposed;

covering said portions of said membrane wafer and each said thin-film with a protectant that is inert in acetone;

etching portions of said protectant through to said membrane wafer, wherein each said thin-film remains fully covered by said protectant;

coupling a handle to said protectant with a wax that dissolves in acetone;

removing portions of said substrate wherein a contiguous region of said membrane wafer is defined and exposed adjacent to each said thin-film and said portions of said protectant so-etched;

exposing said wax to acetone wherein said wax dissolves and said handle is uncoupled from said protectant;

etching through said contiguous region of said membrane wafer at said portions of said protectant so-etched; and

removing said protectant.