	US 12,259,653 B2
	Radiation-sensitive resin composition, method of forming resist pattern, and compound
Katsuaki Nishikori, Tokyo (JP)
Assigned to JSR CORPORATION, Tokyo (JP)
Filed by JSR CORPORATION, Tokyo (JP)
Filed on Dec. 3, 2021, as Appl. No. 17/541,422.
Application 17/541,422 is a continuation of application No. PCT/JP2020/016474, filed on Apr. 14, 2020.
Claims priority of application No. 2019-106474 (JP), filed on Jun. 6, 2019.
Prior Publication US 2022/0091508 A1, Mar. 24, 2022
Int. Cl. G03F 7/039 (2006.01); C07C 51/02 (2006.01); C07C 55/10 (2006.01); C07C 55/32 (2006.01); G03F 7/004 (2006.01); G03F 7/20 (2006.01); G03F 7/30 (2006.01); G03F 7/32 (2006.01); G03F 7/38 (2006.01); G03F 7/40 (2006.01)

CPC G03F 7/0392 (2013.01) [C07C 51/02 (2013.01); C07C 55/10 (2013.01); C07C 55/32 (2013.01); G03F 7/0045 (2013.01); G03F 7/0397 (2013.01); G03F 7/2004 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01); G03F 7/40 (2013.01)]

19 Claims

1. A radiation-sensitive resin composition comprising:

a polymer which comprises a structural unit comprising an acid-labile group;

a radiation-sensitive acid generator; and

a compound represented by formula (1):

wherein, in the formula (1), R¹represents a monovalent organic group having 1 to 30 carbon atoms; and Xⁿ⁺represents a radiation-sensitive onium cation having a valency of n, wherein n is an integer of 1 to 3.