US 12,259,647 B2
Method of manufacturing extreme ultraviolet (EUV) photomask and method and apparatus for correcting EUV photomask
Jongkeun Oh, Seoul (KR); Sanguk Park, Yongin-si (KR); Gyeongcheon Jo, Hwaseong-si (KR); and Jongju Park, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jul. 9, 2021, as Appl. No. 17/371,375.
Claims priority of application No. 10-2020-0132574 (KR), filed on Oct. 14, 2020.
Prior Publication US 2022/0113619 A1, Apr. 14, 2022
Int. Cl. G03F 1/24 (2012.01); H01L 21/027 (2006.01)
CPC G03F 1/24 (2013.01) [H01L 21/0274 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method comprising:
preparing a mask blank, the mask blank comprising a substrate, a reflective layer disposed on the substrate for reflecting extreme ultraviolet light, and a light absorbing layer disposed on the reflective layer;
providing a photomask by forming a plurality of pattern elements having a target critical dimension from the light absorbing layer, wherein the plurality of pattern elements comprise a correction target pattern element to be corrected, and the correction target pattern element has a critical dimension different from the target critical dimension;
identifying a portion of the photomask in which the correction target pattern element is disposed as a correction target area;
applying an etchant to the photomask; and
locally irradiating a laser beam to the correction target area while the etchant is provided on the photomask.