US 12,259,446 B2
Sensor and inspection device
Akira Kikitsu, Yokohama Kanagawa (JP); Yoshihiro Higashi, Komatsu Ishikawa (JP); and Satoshi Shirotori, Yokohama Kanagawa (JP)
Assigned to Kabushiki Kaisha Toshiba, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP)
Filed on Feb. 3, 2023, as Appl. No. 18/164,471.
Claims priority of application No. 2022-107817 (JP), filed on Jul. 4, 2022.
Prior Publication US 2024/0003998 A1, Jan. 4, 2024
Int. Cl. G01R 33/09 (2006.01)
CPC G01R 33/09 (2013.01) 20 Claims
OG exemplary drawing
 
1. A sensor, comprising:
an element portion including a first element,
the first element including a first magnetic element, a first conductive member, and a first magnetic portion,
the first magnetic element including a first magnetic layer and a first opposing magnetic layer,
a length of the first magnetic element along a second direction crossing a first direction from the first magnetic layer to the first opposing magnetic layer being longer than a length of the first magnetic element along a third direction crossing a plane including the first direction and the second direction,
the first conductive member including a first conductive portion and a first other conductive portion,
a direction from the first other conductive portion to the first conductive portion being along the second direction, and
a direction from the first magnetic portion to the first magnetic element being along the second direction.