US 12,259,430 B1
Technologies for on-circuit board de-embedding
Bishnu Prasad Patra, Zoetermeer (NL); and Stefano Pellerano, Beaverton, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jul. 22, 2022, as Appl. No. 17/871,414.
Int. Cl. G01R 31/28 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01)
CPC G01R 31/2884 (2013.01) [H05K 1/0268 (2013.01); H05K 1/029 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49176 (2013.01); H05K 2201/10053 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A system comprising:
a circuit board comprising:
a connector to mate with a cable;
a trace connected to the connector; and
one or more micromechanical switches to switch the trace between (i) a short circuit, (ii) an open circuit, (iii) a load circuit, and (iv) a through circuit.