US 12,259,428 B1
Multiplexed thermal control wafer and coldplate
Samer Kabbani, Laguna Niguel, CA (US); Taneli Veistinen, Lieto (FI); Terry Sinclair Connacher, Tempe, AZ (US); Sami Mikola, Mynämäki (FI); Thomas P. Jones, Stanwood, MI (US); and Ari Kuukkala, Turku (FI)
Assigned to AEM Singapore Pte. Ltd., Singapore (SG)
Filed by AEM Singapore Pte. Ltd., Singapore (SG)
Filed on Apr. 22, 2024, as Appl. No. 18/642,142.
Application 18/642,142 is a continuation of application No. 18/390,918, filed on Dec. 20, 2023, granted, now 12,000,885.
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2875 (2013.01) [G01R 31/2877 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A method for controlling one or more temperatures of one or more devices under test (DUTs), the method comprising:
receiving an energy input to a thermal control assembly (TCA); and
independently controlling a plurality of independently controllable thermal zones of the TCA, comprising:
selectively controlling a plurality of independently controllable heater zones of the plurality of independently controllable thermal zones, comprising selectively applying the energy input to one or more of the plurality of independently controllable heater zones; and
selectively controlling a plurality of independently controllable cooling zones of the plurality of independent controllable thermal zones,
wherein the plurality of independently controllable heater zones and the plurality of independently controllable cooling zones are configured to maintain or change a temperature of a top surface of the TCA.