US 12,259,419 B2
Test device and probe polishing method
Masahito Kobayashi, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Oct. 20, 2021, as Appl. No. 17/506,372.
Claims priority of application No. 2020-177874 (JP), filed on Oct. 23, 2020.
Prior Publication US 2022/0128603 A1, Apr. 28, 2022
Int. Cl. G01R 3/00 (2006.01); B24B 19/16 (2006.01); G01R 1/073 (2006.01)
CPC G01R 3/00 (2013.01) [B24B 19/16 (2013.01); G01R 1/07342 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A test device configured to test a substrate under test, comprising:
a mounting table for test on which the substrate under test is mounted;
a transportation mechanism configured to transport at least the substrate under test;
a mounting table for polishing on which a polishing substrate, the polishing substrate being a member configured to polish a probe coming into contact with a substrate during its test and has a shape and size transportable by the transportation mechanism, is mounted;
a first forward or backward movement mechanism configured to move the mounting table for test forward or backward with respect to the probe;
a second forward or backward movement mechanism configured to move the mounting table for polishing forward or backward with respect to the probe; and
a rotating mechanism configured to rotate the mounting table for polishing,
wherein the mounting table for polishing is provided separately from the mounting table for test,
wherein a retreat region of the mounting table for test is at a position opposite to a retreat region of the mounting table for polishing, with the probe interposed therebetween in a plan view, and
wherein the second forward or backward movement mechanism is configured such that a portion of the polishing substrate, mounted on the mounting table for polishing, on a front side, which is an opposite side to a retreat region of the polishing substrate, overlaps the probe in a plan view while a portion of the polishing substrate on an inner side, which is the retreat region of the polishing substrate, does not overlap the probe in a plan view, and
wherein, by the rotating mechanism and the second forward or backward movement mechanism, a region of the polishing substrate mounted on the mounting table, that was the inner side and could not be overlapped with the probe in a plan view, is overlapped with the probe in a plan view as a region of the front side.