US 12,259,403 B2
Inertial sensor module
Toru Watanabe, Matsumoto (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Sep. 28, 2022, as Appl. No. 17/954,768.
Claims priority of application No. 2021-160811 (JP), filed on Sep. 30, 2021.
Prior Publication US 2023/0099306 A1, Mar. 30, 2023
Int. Cl. G01P 15/14 (2013.01); G01P 1/02 (2006.01); G01P 15/18 (2013.01)
CPC G01P 15/14 (2013.01) [G01P 1/023 (2013.01); G01P 15/18 (2013.01)] 1 Claim
OG exemplary drawing
 
1. An inertial sensor module comprising:
a first sensor having a first axis, a second axis, and a third axis as detection axes;
a second sensor having accuracy higher than that of the first sensor and having the third axis as a detection axis; and
a package including a base substrate and a lid body, wherein
the first sensor and the second sensor are disposed on one plane in the package,
the base substrate is formed with a recess, and the lid body is bonded to an upper surface of the base substrate to seal an airtight internal space between the base substrate and the lid body at the recess,
the first sensor and the second sensor are sealed by the package in an airtight manner, in the airtight internal space between the base substrate and the lid body,
the first sensor and the second sensor detect a same physical quantity, and wherein
the inertial sensor module further comprises an alignment structure provided on the plane on which the first sensor and the second sensor are disposed, wherein
the alignment structure is provided on an inner bottom surface of the base substrate of the package and is a plurality of recesses that are formed at the inner bottom surface having a same depth, and
the first sensor is disposed within one of the plurality of recesses and the second sensor is disposed within an other of the plurality of recesses.