US 12,259,365 B2
Methodology and instrumentation for thin film mechanical analysis
Xiaodan Gu, Hattiesburg, MS (US); Dakota F. Ehlenberg, Baton Rouge, LA (US); and Song Zhang, Hattiesburg, MS (US)
Assigned to The University of Southern Mississippi, Hattiesburg, MS (US)
Filed by The University of Southern Mississippi, Hattiesburg, MS (US)
Filed on May 1, 2019, as Appl. No. 16/401,009.
Claims priority of provisional application 62/665,219, filed on May 1, 2018.
Prior Publication US 2019/0339180 A1, Nov. 7, 2019
Int. Cl. G01N 3/08 (2006.01); G01B 13/24 (2006.01); G01N 3/02 (2006.01)
CPC G01N 3/08 (2013.01) [G01B 13/24 (2013.01); G01N 3/02 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A thin film tensile instrument for analyzing thin film mechanical properties, the instrument comprising:
an electronic control linear stage for controlling the force applied to a thin film;
a load cell unit for determining the force applied to the thin film;
at least two sample grips for securing the thin film, each of the at least two sample grips including a thin adhesive layer configured to adhere to the thin film, wherein the grips are positioned on opposite sides of the thin film;
a first and a second L-shaped arm for mounting the thin film to be analyzed;
a first vertical stage for mounting the first L-shaped arm and the linear stage and a second vertical stage for mounting the second L-shaped arm and the load cell unit;
a fluid support for the thin film, wherein the support includes a liquid bath holding a liquid and the first and second L-shaped arms are configured to position the thin film on a surface of the liquid held by the liquid bath;
a temperature stage to control a temperature of the liquid of the liquid bath; and
a motor to move the linear stage and the thin film.