US 12,259,323 B2
Photonic structures and integrated device for detecting and analyzing molecules
Jonathan M. Rothberg, Miami Beach, FL (US); Ali Kabiri, Guilford, CT (US); Gerard Schmid, Guilford, CT (US); Keith G. Fife, Palo Alto, CA (US); James Beach, Austin, TX (US); Jason W. Sickler, Arlington, MA (US); Lawrence C. West, San Jose, CA (US); Paul E. Glenn, Wellesley, MA (US); Kyle Preston, Guilford, CT (US); Farshid Ghasemi, Guilford, CT (US); Benjamin Cipriany, Branford, CT (US); and Jeremy Lackey, Foster City, CA (US)
Assigned to Quantum-Si Incorporated, Branford, CT (US)
Filed by Quantum-Si Incorporated, Guilford, CT (US)
Filed on Jul. 11, 2022, as Appl. No. 17/862,297.
Application 17/161,425 is a division of application No. 15/611,583, filed on Jun. 1, 2017, granted, now 11,226,290, issued on Jan. 18, 2022.
Application 17/862,297 is a continuation of application No. 17/161,425, filed on Jan. 28, 2021, granted, now 11,422,092.
Claims priority of provisional application 62/344,123, filed on Jun. 1, 2016.
Prior Publication US 2022/0349823 A1, Nov. 3, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G01N 21/64 (2006.01); C12Q 1/6869 (2018.01); C12Q 1/6874 (2018.01); G01N 21/77 (2006.01); G01N 33/543 (2006.01)
CPC G01N 21/6428 (2013.01) [C12Q 1/6869 (2013.01); C12Q 1/6874 (2013.01); G01N 21/6408 (2013.01); G01N 21/6454 (2013.01); G01N 21/648 (2013.01); G01N 21/6486 (2013.01); G01N 21/7743 (2013.01); G01N 33/54373 (2013.01); G01N 2021/6419 (2013.01); G01N 2021/6421 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An integrated device comprising:
a substrate;
a cladding layer disposed on the substrate;
a waveguide, disposed in the cladding layer, having a first side facing the substrate and a second side opposite the first side;
a plurality of metal layers, disposed in the cladding layer, wherein a first metal layer of the plurality of metal layers is positioned at a distance closer to the substrate than the first side of the waveguide and the waveguide is positioned at a distance closer to the substrate than a second metal layer of the plurality of metal layers;
a conductive via connecting adjacent metal layers of the plurality of metal layers; and
an array of sample wells, disposed in the cladding layer, wherein a sample well of the array of sample wells is configured to receive a sample.