US 12,259,289 B2
Sensor header assembly for increased reliability in high-pressure environments
Alexander A. Ned, Kinnelon, NJ (US); and Scott Goodman, Wayne, NJ (US)
Assigned to KULITE SEMICONDUCTOR PRODUCTS, INC., Leonia, NJ (US)
Filed by KULITE SEMICONDUCTOR PRODUCTS, INC., Leonia, NJ (US)
Filed on Oct. 10, 2023, as Appl. No. 18/483,731.
Application 18/483,731 is a continuation of application No. 17/823,765, filed on Aug. 31, 2022, granted, now 11,802,804.
Application 17/823,765 is a continuation of application No. 17/034,533, filed on Sep. 28, 2020, granted, now 11,467,049, issued on Oct. 11, 2022.
Application 17/034,533 is a continuation of application No. 16/205,836, filed on Nov. 30, 2018, granted, now 10,788,386, issued on Sep. 29, 2020.
Prior Publication US 2024/0035911 A1, Feb. 1, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01L 19/00 (2006.01); G01L 19/14 (2006.01)
CPC G01L 19/0084 (2013.01) [G01L 19/0069 (2013.01); G01L 19/147 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A header assembly, comprising:
an upper header layer, comprising:
two or more upper through holes disposed in a first configuration, the two or more upper through holes configured to accept upper header pins;
a lower header layer, comprising:
two or more lower through holes disposed in a second configuration axially offset relative to the first configuration, the two or more lower through holes configured to accept lower header pins; and
two or more depressions in a top surface of the lower header layer and extending partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the upper through holes of the upper header layer.