US 12,259,287 B2
Low hysteresis and flexible pressure sensitive composite
Chee Keong Tee, Singapore (SG); Haicheng Yao, Singapore (SG); Weidong Yang, Singapore (SG); and Yu Jun Tan, Singapore (SG)
Assigned to NATIONAL UNIVERSITY OF SINGAPORE, Singapore (SG)
Appl. No. 17/429,071
Filed by NATIONAL UNIVERSITY OF SINGAPORE, Singapore (SG)
PCT Filed Feb. 7, 2020, PCT No. PCT/SG2020/050061
§ 371(c)(1), (2) Date Aug. 6, 2021,
PCT Pub. No. WO2020/162836, PCT Pub. Date Aug. 13, 2020.
Claims priority of application No. 10201901119P (SG), filed on Feb. 8, 2019.
Prior Publication US 2022/0128420 A1, Apr. 28, 2022
Int. Cl. G01L 1/22 (2006.01); B81B 1/00 (2006.01); B81C 1/00 (2006.01)
CPC G01L 1/2287 (2013.01) [B81B 1/008 (2013.01); B81C 1/00111 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0361 (2013.01); B81B 2203/04 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A sensing structure for a compressive-type pressure sensor, the sensing structure comprising:
an elastic micropatterned substrate defining a plurality of 3-dimensional microstructures, each microstructure comprising a tip portion pointing away from the substrate in a first direction; and
a conductive film on the elastic micropatterned substrate such that the 3-dimensional microstructures are substantially covered by the conductive film, wherein the conductive film comprises cracks in areas on 3-dimensional microstructures;
wherein the conductive film is free from cracks at the tip portions of the 3-dimensional microstructures.