US 12,259,110 B1
Optical packaging structure and backlight module having the same
Chuang-Yu Hsieh, Hsinchu (TW); Hsin-Ting Hung, Hsinchu (TW); Hao-Hsiang Hsieh, Hsinchu (TW); and Shih-Hsiang Lo, Hsinchu (TW)
Assigned to ADVANCED OPTOELECTRONIC TECHNOLOGY, INC., Hsinchu County (TW)
Filed by ADVANCED OPTOELECTRONIC TECHNOLOGY, INC., Hsinchu County (TW)
Filed on Aug. 19, 2024, as Appl. No. 18/808,295.
Claims priority of application No. 202420468338.9 (CN), filed on Mar. 8, 2024.
Int. Cl. F21V 15/01 (2006.01); F21V 5/04 (2006.01); F21V 7/00 (2006.01); F21V 9/30 (2018.01); F21Y 113/00 (2016.01)
CPC F21V 15/01 (2013.01) [F21V 5/04 (2013.01); F21V 7/0066 (2013.01); F21V 9/30 (2018.02); F21Y 2113/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical packaging structure comprising:
at least one light-emitting chip comprising a light-emitting surface, a connecting surface opposite to the light-emitting surface, and a first side surface connected to the light-emitting surface and the connecting surface;
a packaging layer comprising a first top surface and a second side surface, wherein the packaging layer covers the light-emitting surface and the first side surface of the at least one light-emitting chip and exposes the connecting surface, the first top surface faces the light-emitting surface, and the second side surface faces the first side surface;
a fluorescent layer covering the first top surface and the second side surface, the fluorescent layer comprising a second top surface spaced from and facing the first top surface;
a lens structure disposed on the second top surface, the lens structure comprising a third top surface spaced from and facing the second top surface, and a curved surface on the third top surface by recessing the third top surface towards the at least one light-emitting chip; and
a reflecting layer disposed on the curved surface.