US 12,258,673 B2
Plating apparatus
Masaki Tomita, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/781,365
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Nov. 9, 2021, PCT No. PCT/JP2021/041137
§ 371(c)(1), (2) Date May 31, 2022,
PCT Pub. No. WO2023/084584, PCT Pub. Date May 19, 2023.
Prior Publication US 2024/0183056 A1, Jun. 6, 2024
Int. Cl. C25D 17/06 (2006.01); C25D 21/10 (2006.01)
CPC C25D 17/06 (2013.01) [C25D 21/10 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a plating tank configured to house a plating solution;
a substrate holder configured to hold a substrate with a surface to be plated facing downward; and
an elevating mechanism configured to move up and down the substrate holder, wherein
the substrate holder includes:
a supporting mechanism configured to support an outer peripheral portion of the surface to be plated of the substrate;
a back plate assembly arranged on a back surface side of the surface to be plated of the substrate, the back plate assembly being configured to sandwich the substrate with the supporting mechanism; and
a removing mechanism configured to provide a force that removes the substrate from the back plate assembly to a back surface of the surface to be plated of the substrate,
wherein the back plate assembly includes:
a floating plate arranged on the back surface side of the surface to be plated of the substrate,
a floating mechanism for biasing the floating plate to a direction away from a back surface of the substrate, and
a pushing mechanism for pressing the floating plate to the back surface of the substrate against a biasing force by the floating mechanism, and
the removing mechanism is configured to provide a force that removes the substrate from the floating plate to the back surface of the surface to be plated of the substrate.