US 12,258,498 B2
Adhesive set, adhesive body, and manufacturing method therefor
Toru Tanaka, Tokyo (JP); Takashi Kawamori, Tokyo (JP); Masahiro Matsunaga, Tokyo (JP); and Yosuke Fujiyasu, Tokyo (JP)
Appl. No. 17/999,865
Filed by Resonac Corporation, Tokyo (JP)
PCT Filed Nov. 17, 2020, PCT No. PCT/JP2020/042819
§ 371(c)(1), (2) Date Nov. 25, 2022,
PCT Pub. No. WO2022/107210, PCT Pub. Date May 27, 2022.
Prior Publication US 2023/0212430 A1, Jul. 6, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B29C 65/48 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); C09J 4/00 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 133/08 (2006.01); C09J 133/10 (2006.01); C09J 133/12 (2006.01)
CPC C09J 4/00 (2013.01) [B29C 65/485 (2013.01); B32B 7/12 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); C09J 133/12 (2013.01); B32B 2037/1269 (2013.01); C08F 2438/01 (2013.01); C09J 2301/408 (2020.08)] 9 Claims
 
1. A two part adhesive comprising:
a first part comprising a decomplexing agent; and
a second part comprising an initiator, the initiator comprising an organoborane complex, wherein
at least one of the first part and the second part further comprises a first compound having a radically polymerizable group, and
at least one of the first part and the second part further comprises a second compound having a thiocarbonylthio structure.