	US 12,258,497 B2
	Moisture-curable adhesive composition
Hideyuki Sakata, Hyogo (JP); and Kenji Kashihara, Hyogo (JP)
Assigned to TOYOBO MC CORPORATION, Osaka (JP)
Appl. No. 17/788,441
Filed by TOYOBO MC Corporation, Osaka (JP)
PCT Filed Dec. 24, 2020, PCT No. PCT/JP2020/048595 § 371(c)(1), (2) Date Jun. 23, 2022, PCT Pub. No. WO2021/132523, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-238878 (JP), filed on Dec. 27, 2019.
Prior Publication US 2023/0090721 A1, Mar. 23, 2023
Int. Cl. B32B 41/00 (2006.01); C09J 7/10 (2018.01); C09J 11/06 (2006.01); C09J 123/08 (2006.01); C09J 133/10 (2006.01); C09J 183/12 (2006.01)

CPC C09J 183/12 (2013.01) [C09J 7/10 (2018.01); C09J 11/06 (2013.01); C09J 123/0892 (2013.01); C09J 133/10 (2013.01); C09J 2301/414 (2020.08); C09J 2423/006 (2013.01)]

10 Claims

1. An adhesive resin composition comprising a moisture-curable resin (A) and a modified polyolefin resin (B), wherein the content of the modified polyolefin resin (B) is 2 parts by mass or more and 100 parts by mass or less, per 100 parts by mass of the moisture-curable resin (A),

wherein the moisture-curable resin (A) is a resin containing a hydrolyzable silyl group at an end and having a main chain comprising a polyether or (meth)acrylate,

wherein the modified polyolefin resin (B) has a polyether structure or a (meth)acrylate polymer structure, and

wherein the modified polyolefin resin (B) is a polyolefin resin having a structure similar to that of the main skeleton of the moisture-curable resin (A).