US 12,258,494 B2
Adhesive for pellicle, pellicle for photo mask and method for manufacturing the same
Mun Ja Kim, Hwaseong-si (KR); and Changyoung Jeong, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Aug. 22, 2023, as Appl. No. 18/236,515.
Application 18/236,515 is a continuation of application No. 16/364,847, filed on Mar. 26, 2019, abandoned.
Claims priority of application No. 10-2018-0073625 (KR), filed on Jun. 26, 2018.
Prior Publication US 2023/0399552 A1, Dec. 14, 2023
Int. Cl. C09J 129/04 (2006.01); C08K 3/36 (2006.01); C08K 5/13 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 179/02 (2006.01); G03F 1/64 (2012.01)
CPC C09J 129/04 (2013.01) [C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 179/02 (2013.01); G03F 1/64 (2013.01); C08K 3/36 (2013.01); C08K 5/13 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of fabricating a photo mask assembly, the method comprising:
combining a frame with a pellicle membrane by providing an adhesive between the frame and the pellicle membrane;
heating the adhesive at a temperature of about 60° C. to about 90° C. to form an adhesive layer; and
combining the frame with a photo mask,
wherein the adhesive consists of about 0.01 M to about 0.2 M of pyrogallol, about 1% to about 20% by weight of polyethylene imine having weight average molecular weight of about 25,000 to about 750,000, about 0.001% to about 0.1% by weight of silica particles, and a remainder of water,
wherein the pellicle membrane includes one or more of silicon, a carbon material, a semiconductive material, or a fluorine-containing polymer,
wherein the frame includes a metal, and
wherein the adhesive layer formed from the adhesive has a bond strength about 7 kgf/cm2 to about 20 kgf/cm2.