US 12,258,491 B2
Polishing liquid, polishing liquid set, and polishing method
Tomomi Kukita, Tokyo (JP); Tomohiro Iwano, Tokyo (JP); and Tomoyasu Hasegawa, Tokyo (JP)
Assigned to Resonac Corporation, Tokyo (JP)
Appl. No. 17/771,919
Filed by Showa Denko Materials Co., Ltd., Tokyo (JP)
PCT Filed Jan. 6, 2021, PCT No. PCT/JP2021/000245
§ 371(c)(1), (2) Date Apr. 26, 2022,
PCT Pub. No. WO2022/149224, PCT Pub. Date Jul. 14, 2022.
Prior Publication US 2023/0203342 A1, Jun. 29, 2023
Int. Cl. C09G 1/02 (2006.01)
CPC C09G 1/02 (2013.01) 21 Claims
 
1. A polishing liquid comprising: abrasive grains; at least one hydroxy acid component selected from the group consisting of a hydroxy acid and a salt thereof; and a compound Z, wherein
the abrasive grains contain a cerium oxide,
a content of the cerium oxide is more than 50% by mass on the basis of the whole abrasive grains contained in the polishing liquid,
the compound Z has a hydrocarbon group which may be substituted and a polyoxyalkylene group, and
a Z value represented by General Formula (1) below is 20 or more:
Z=0.1×a2×b/c  (1)
[in Formula (1), “a” represents the number of carbon atoms of the hydrocarbon group, “b” represents the total number of oxyalkylene groups in the compound Z, and “c” represents an HLB value of the compound Z].