US 12,258,468 B2
Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package
Yuya Hirayama, Tokyo (JP); Keisuke Kushida, Tokyo (JP); Kenichi Tomioka, Tokyo (JP); and Hiroshi Shimizu, Tokyo (JP)
Assigned to Resonac Corporation, Tokyo (JP)
Appl. No. 17/043,357
Filed by HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)
PCT Filed Mar. 29, 2019, PCT No. PCT/JP2019/014141
§ 371(c)(1), (2) Date Sep. 29, 2020,
PCT Pub. No. WO2019/189811, PCT Pub. Date Oct. 3, 2019.
Claims priority of application No. PCT/JP2018/013930 (WO), filed on Mar. 30, 2018.
Prior Publication US 2021/0024741 A1, Jan. 28, 2021
Int. Cl. C08L 61/06 (2006.01); B32B 15/098 (2006.01); C08J 5/24 (2006.01); C08L 63/00 (2006.01); H05K 1/05 (2006.01)
CPC C08L 61/06 (2013.01) [B32B 15/098 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08L 63/00 (2013.01); H05K 1/056 (2013.01); B32B 2305/076 (2013.01); B32B 2307/738 (2013.01); B32B 2363/00 (2013.01)] 9 Claims
 
1. A thermosetting resin composition comprising (A) a phenol-based resin and (B) a thermosetting resin,
the component (A) containing (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms, having a weight average molecular weight (Mw) of 1,412 to 1,738, and having a hydroxy group equivalent of 214 to 238 g/eq, and (A-2) a phenol-based resin that does not have an aliphatic hydrocarbon group having 10 to 25 carbon atoms and having a hydroxy group equivalent of 80 to 150 g/eq, wherein:
the component (A-1) has at least one kind of a structural unit selected from the group consisting of a structural unit (a1) represented by the following general formula (a1) and a structural unit (a2) represented by the following general formula (a2):

OG Complex Work Unit Chemistry
wherein R1 represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 9 carbon atoms, which optionally have a substituent, an aromatic hydrocarbon group having 5 to 15 ring atoms, which optionally have a substituent, or a combination of the aliphatic hydrocarbon group and the aromatic hydrocarbon group; R2 represents an aliphatic hydrocarbon group having 10 to 25 carbon atoms; X represents a hydrogen atom, a hydroxy group, or a hydroxymethyl group; and m and n each independently represent 0 or 1;
the component (A-2) comprises a cresol novolac phenol resin;
the component (B) comprises at least one thermosetting resin selected from the group consisting of a dicyclopentadiene epoxy resin, a tetrabromobisphenol A epoxy resin, a naphthalene skeleton-containing novolac epoxy resin, a phenol novolac epoxy resin, and a phenol biphenyl aralkyl epoxy resin, wherein a content of the component (B) is 60 to 90 parts by mass per 100 parts by mass of the total resin content of the thermosetting resin composition;
the thermosetting resin composition further comprises a curing accelerator (C) in an amount of 0.01 to 10 parts by mass per 100 parts by mass of the total resin content of the thermosetting resin composition, a filler (D) in an amount of 5 to 40 parts by mass per 100 parts by mass of the total resin content of the thermosetting resin composition, and a coupling agent in an amount of 0.01 to 20 parts by mass per 100 parts by mass of the total resin content of the thermosetting resin composition; and
a content of the component (A-1) is from 10 to 18 parts by mass per 100 parts by mass of the total resin content of the thermosetting resin composition and a content ratio of the component (A-1) is from 30 to 95% by mass based on the total amount of the component (A-1) and the component (A-2).