US 12,258,460 B2
Polishing pad and method of fabricating semiconductor device using the same
Eun Sun Joeng, Gyeonggi-do (KR); Jong Wook Yun, Seoul (KR); Jang Won Seo, Seoul (KR); Yong Ju Jeong, Gyeonggi-do (KR); and Seung Kyun Kim, Gyeonggi-do (KR)
Assigned to SK ENPULSE CO., LTD., Gyeonggi-Do (KR)
Filed by SK enpulse Co., Ltd., Gyeonggi-do (KR)
Filed on Sep. 7, 2021, as Appl. No. 17/467,671.
Claims priority of application No. 10-2020-0113708 (KR), filed on Sep. 7, 2020; application No. 10-2020-0128532 (KR), filed on Oct. 6, 2020; and application No. 10-2020-0128586 (KR), filed on Oct. 6, 2020.
Prior Publication US 2022/0073694 A1, Mar. 10, 2022
Int. Cl. C08J 9/232 (2006.01); B24B 37/24 (2012.01); C08G 18/16 (2006.01); C08G 18/22 (2006.01); C08G 18/32 (2006.01); C08G 18/48 (2006.01); C08G 18/66 (2006.01); C08G 18/76 (2006.01); C09K 3/14 (2006.01); H01L 21/3105 (2006.01)
CPC C08J 9/232 (2013.01) [B24B 37/24 (2013.01); C08G 18/161 (2013.01); C08G 18/168 (2013.01); C08G 18/225 (2013.01); C08G 18/3206 (2013.01); C08G 18/4854 (2013.01); C08G 18/6674 (2013.01); C08G 18/7621 (2013.01); C08G 18/7671 (2013.01); C09K 3/14 (2013.01); H01L 21/31053 (2013.01); C08G 2110/0025 (2021.01); C08J 2203/22 (2013.01); C08J 2375/08 (2013.01)] 10 Claims
 
1. A polishing pad comprising a polishing layer, wherein a nuclear magnetic resonance (NMR) 13C spectrum of a processed composition prepared by adding 1 g of the polishing layer to a 0.3 M aqueous solution of potassium hydroxide (KOH) and allowing the mixture to react in a closed container at a temperature of 150° C. for 48 hours includes a first peak appearing at 15 ppm to 18 ppm, a second peak appearing at 9 ppm to 11 ppm, a third peak appearing at 138 ppm to 143 ppm, and a fourth peak appearing at 55 ppm to 65 ppm, and
a softening control index calculated by Equation 1 below is 0.10 to 0.45,
wherein, the polishing layer comprises a cured product of a preliminary composition containing a urethane-based prepolymer,
wherein, the preliminary composition contains a reaction product of an isocyanate compound and a polyol compound, and
the isocyanate compound includes an aromatic diisocyanate and an alicyclic diisocyanate compound, and
the alicyclic diisocyanate compound is 5 parts by weight to 30 parts by weight based on 100 parts by weight of the aromatic diisocyanate,

OG Complex Work Unit Math
wherein I2 is a ratio of the area of the second peak to the area of the first peak which is taken as 100.00, I3 is a ratio of the area of the third peak to the area of the first peak which is taken as 100.00, and I4 is a ratio of the area of the fourth peak to the area of the first peak which is taken as 100.00.