US 12,258,447 B2
Polyimide film, method for producing same, and flexible metal foil clad laminate comprising same
Dong Young Won, Chungcheongbuk (KR); and Dong Young Kim, Chungcheongbuk (KR)
Assigned to PI Advanced Materials Co., Ltd., Jincheon-gun (KR)
Appl. No. 17/780,373
Filed by PI Advanced Materials Co., Ltd., Chungcheongbuk (KR)
PCT Filed Apr. 23, 2020, PCT No. PCT/KR2020/005389
§ 371(c)(1), (2) Date May 26, 2022,
PCT Pub. No. WO2021/107294, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 10-2019-0157572 (KR), filed on Nov. 29, 2019.
Prior Publication US 2023/0049631 A1, Feb. 16, 2023
Int. Cl. C08G 73/10 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01)
CPC C08G 73/1067 (2013.01) [B32B 15/08 (2013.01); B32B 27/281 (2013.01); B32B 2250/40 (2013.01); B32B 2307/308 (2013.01)] 4 Claims
 
1. A polyimide film comprising:
a first imide bond unit having a glass transition temperature of 400° C. or higher; and
a second imide bond unit having a glass transition temperature of less than 400° C.,
wherein the first imide bond unit is derived from coupling between a first dianhydride monomer and a diamine monomer and the second imide bond unit is derived from coupling between a second dianhydride monomer and a diamine monomer,
wherein the first dianhydride monomer of the first imide bond unit comprises pyromellitic dianhydride (PMDA),
wherein the diamine monomer of the first imide bond unit comprises 4,4′-oxydianiline (ODA),
wherein the first imide bond unit is present in an amount of about 39 mol % to about 90 mol % in the polyimide film;
wherein the polyimide film has a glass transition temperature of 374° C. or higher and 415° C. or lower,
wherein the polyimide film has a coefficient of thermal expansion of 3.0 ppm/° C. or more and 5.7 ppm/° C. or less, as calculated averaging coefficients of thermal expansion in a machine direction (MD) and in a transverse direction (TD).