US 12,258,264 B2
Microelectromechanical system (MEMS) interconnect including spring body with at least two spring arms micromachined from silicon substrate
Muir Kumph, Croton on Hudson, NY (US); and Vivekananda P. Adiga, Ossining, NY (US)
Assigned to INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed by INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)
Filed on Jun. 3, 2022, as Appl. No. 17/805,436.
Prior Publication US 2023/0391609 A1, Dec. 7, 2023
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01); H10N 60/10 (2023.01)
CPC B81B 7/0006 (2013.01) [B81C 1/00626 (2013.01); H10N 60/10 (2023.02); B81B 2207/015 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectromechanical system (MEMS) device, comprising:
a silicon substrate having a top surface;
an interconnect machined from the silicon substrate, wherein:
the interconnect includes a spring body,
the spring body includes two or more spring arms, wherein each spring arm includes:
a first end distal from a center of the interconnect;
a second end proximate the center of the interconnect; and
one or more silicon bumps on the center of the interconnect configured to make vertical physical contact with a connection point on another device, wherein the spring body is configured to provide vertical leeway in a direction of the physical contact.