US 12,258,262 B2
Substrate and microphone unit
Shingo Okano, Osaka (JP)
Assigned to HOSIDEN CORPORATION, Osaka (JP)
Appl. No. 17/607,696
Filed by HOSIDEN CORPORATION, Osaka (JP)
PCT Filed May 13, 2020, PCT No. PCT/JP2020/019048
§ 371(c)(1), (2) Date Oct. 29, 2021,
PCT Pub. No. WO2020/235408, PCT Pub. Date Nov. 26, 2020.
Claims priority of application No. 2019-096833 (JP), filed on May 23, 2019.
Prior Publication US 2022/0219968 A1, Jul. 14, 2022
Int. Cl. B81B 3/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01)
CPC B81B 3/0008 (2013.01) [B81B 2201/0257 (2013.01); B81B 2203/0353 (2013.01); B81B 2207/096 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A substrate having one surface connected to a MEMS microphone, comprising:
a substrate sound hole that penetrates through the substrate and communicates with a sound hole of the MEMS microphone;
a GND pad which has a circular ring shape disposed around the substrate sound hole on another surface of the substrate, wherein the GND pad is not a pad used for connecting to other components on a solder surface thereof; and
an excess solder that is provided on the GND pad, wherein the excess solder is not connected to the other components.