US 12,257,759 B2
Film molding device
Kazuya Hioki, Yokosuka (JP)
Assigned to SUMITOMO HEAVY INDUSTRIES, LTD., Tokyo (JP)
Filed by SUMITOMO HEAVY INDUSTRIES, LTD., Tokyo (JP)
Filed on Jun. 6, 2023, as Appl. No. 18/329,612.
Application 18/329,612 is a continuation of application No. PCT/JP2022/013699, filed on Mar. 23, 2022.
Claims priority of application No. 2021-060747 (JP), filed on Mar. 31, 2021.
Prior Publication US 2023/0311400 A1, Oct. 5, 2023
Int. Cl. B29C 48/10 (2019.01); B29C 48/88 (2019.01); B29L 23/00 (2006.01)
CPC B29C 48/913 (2019.02) [B29C 48/10 (2019.02); B29L 2023/001 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A film molding device comprising:
a cooling unit that cools a molding material discharged from a mold; and
a rectifying unit that rectifies cooling air blown out from the cooling unit,
wherein the rectifying unit includes a suction portion that suctions the cooling air,
the cooling unit cools the molding material discharged in a substantially cylindrical shape from the mold,
the rectifying unit includes a plurality of rectifying plates disposed outside the molding material in a radial direction along the molding material, and
the suction portion suctions the cooling air into a space divided by the plurality of rectifying plates along the rectifying plates.