	US 12,257,745 B2
	Sheet molding compound and fiber-reinforced composite
Akira Oota, Tokyo (JP); and Hayato Ogasawara, Tokyo (JP)
Assigned to Mitsubishi Chemical Corporation, Tokyo (JP)
Filed by Mitsubishi Chemical Corporation, Tokyo (JP)
Filed on Mar. 4, 2021, as Appl. No. 17/192,103.
Application 17/192,103 is a continuation of application No. PCT/JP2019/034369, filed on Sep. 2, 2019.
Claims priority of application No. 2018-165832 (JP), filed on Sep. 5, 2018.
Prior Publication US 2021/0221969 A1, Jul. 22, 2021
Int. Cl. B29C 43/00 (2006.01); B29C 43/02 (2006.01); B29C 70/10 (2006.01); C08J 5/24 (2006.01); B29K 63/00 (2006.01); B29K 105/00 (2006.01); B29K 105/08 (2006.01); B29K 307/04 (2006.01)

CPC B29C 43/003 (2013.01) [B29C 43/021 (2013.01); B29C 70/10 (2013.01); C08J 5/24 (2013.01); B29K 2063/00 (2013.01); B29K 2105/0872 (2013.01); B29K 2105/251 (2013.01); B29K 2307/04 (2013.01); C08J 2363/00 (2013.01)]

9 Claims

1. A method of producing a sheet molding compound, the method comprising:

impregnating reinforcing fiber with an epoxy resin composition;

wherein:

the epoxy resin composition comprises:

component (A): an epoxy resin that is in a liquid state at 25° C.;

component (B): an acid anhydride that is in a liquid state at 25° C. in an amount of 1 to 30% by mass with respect to a total mass of epoxy resins in the epoxy resin composition;

component (C): a curing agent having a melting point of 40° C. or higher and lower than 180° C. in an amount of 1 to 10% by mass with respect to the total mass of epoxy resins in the epoxy resin composition; and

component (D): a curing agent having a melting point of 180° C. to 300° C. in an amount of 0.1 to 10% by mass with respect to the total mass of epoxy resins in the epoxy resin composition; and

component (A) comprises a glycidylamine-based epoxy resin in an amount of 1% to 30% by mass with respect to a total mass of component (A).