US 12,257,666 B2
Surface height measurement method using dummy disk
Hiroyuki Shinozaki, Tokyo (JP); and Yasuyuki Motoshima, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Sep. 13, 2023, as Appl. No. 18/466,002.
Application 18/466,002 is a division of application No. 16/708,388, filed on Dec. 9, 2019, abandoned.
Claims priority of application No. 2019-015564 (JP), filed on Jan. 31, 2019.
Prior Publication US 2023/0415299 A1, Dec. 28, 2023
Int. Cl. B24B 17/08 (2006.01); B24B 1/04 (2006.01); B24B 37/005 (2012.01); B24B 37/07 (2012.01); B24B 37/10 (2012.01); B24B 37/16 (2012.01); B24B 37/26 (2012.01); B24B 53/017 (2012.01); B24B 53/12 (2006.01)
CPC B24B 37/16 (2013.01) [B24B 1/04 (2013.01); B24B 17/08 (2013.01); B24B 37/005 (2013.01); B24B 37/07 (2013.01); B24B 37/10 (2013.01); B24B 37/26 (2013.01); B24B 53/017 (2013.01); B24B 53/12 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A method, performing by a data processing portion, comprising:
making a polishing table and a dummy disk rotate;
bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface;
measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface;
creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface;
calculating a tilt angle of the table profile with respect to a horizontal line that is a virtual line indicating a horizontal direction of the polishing table;
correcting the table profile by that the data processing portion make the table profile rotate with respect to the horizontal line until the tilt angle is 0°;
rotating the polishing pad arranged on the table surface along with the polishing table, and rotating the dressing disk;
bringing the dressing disk into contact with a polishing surface of the polishing pad while the liquid is supplied to the polishing surface;
measuring heights of the polishing surface at a plurality of measurement points while the dressing disk is moved on the polishing surface; and
creating an initial pad profile showing a height distribution of the polishing surface from measurement values of the heights of the polishing surface,
wherein the dummy disk is fixed to a disk holder of a dresser when the heights of the table surface of the polishing table are measured,
the dummy disk comprises:
a first surface capable of coming into contact with the disk holder; and
a second surface which is on an opposite side of the first surface,
wherein the second surface has a plurality of liquid discharge channels, and
the plurality of liquid discharge channels extends from one end of the second surface to the other end,
wherein the dressing disk is fixed to the disk holder of the dresser when the polishing surface of the polishing pad is dressed, and the dressing disk comprises:
a first surface capable of coming into contact with the disk holder; and
a second surface which is on an opposite side of the first surface of the dressing disk,
wherein the second surface of the dressing disk has a plurality of protrusion portions and the plurality of liquid discharge channels positioned between the plurality of protrusion portions,
the plurality of liquid discharge channels extends from one end of the second surface to the other end, and
abrasive grains are fixed to surfaces of the plurality of protrusion portions.