US 12,257,664 B2
Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer
Kevin H. Song, San Jose, CA (US); and Benedict W. Pang, Burlingame, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Feb. 25, 2020, as Appl. No. 16/800,777.
Claims priority of provisional application 62/841,769, filed on May 1, 2019.
Claims priority of provisional application 62/812,212, filed on Feb. 28, 2019.
Prior Publication US 2020/0276685 A1, Sep. 3, 2020
Int. Cl. B24B 37/00 (2012.01); B24B 37/005 (2012.01); B24B 37/22 (2012.01); B24B 37/26 (2012.01); B24B 37/32 (2012.01); B24B 53/00 (2006.01)
CPC B24B 37/005 (2013.01) [B24B 37/22 (2013.01); B24B 37/26 (2013.01); B24B 53/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A polishing pad for a chemical mechanical polishing apparatus, comprising:
a polishing layer of the polishing pad having a polishing surface;
a backing layer of the polishing pad formed of a fluid-permeable material and having a lower surface configured to be secured to a platen and an upper surface secured to the polishing layer; and
a plurality of fluid-impermeable seals including a first seal that circumferentially seals an edge of the backing layer and a second seal that seals and separates the backing layer into a first region and a second region,
wherein the plurality of fluid-impermeable seals extend from the lower surface of the backing layer to the upper surface of the backing layer.