US 12,257,650 B2
Joined structure, joining method, and joining material
Takahiro Kumakawa, Kyoto (JP)
Assigned to Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Aug. 11, 2020, as Appl. No. 16/990,285.
Application 16/990,285 is a division of application No. 16/199,807, filed on Nov. 26, 2018, abandoned.
Claims priority of application No. 2017-231347 (JP), filed on Dec. 1, 2017.
Prior Publication US 2020/0373269 A1, Nov. 26, 2020
Int. Cl. B23K 35/02 (2006.01); B22F 1/054 (2022.01); B22F 7/06 (2006.01); B32B 15/04 (2006.01); B32B 15/16 (2006.01); H01L 23/00 (2006.01); B22F 1/10 (2022.01)
CPC B23K 35/025 (2013.01) [B22F 1/054 (2022.01); B22F 7/064 (2013.01); B32B 15/04 (2013.01); B32B 15/16 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B22F 1/10 (2022.01); B32B 2264/105 (2013.01); H01L 2224/29209 (2013.01); H01L 2224/29213 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83862 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A joining method, comprising:
(i) supplying, onto a first surface of a first member, a nanometal paste at least comprising metal nanoparticles and a solvent, and a spacer;
(ii) arranging a second member to face the first member, and pushing the second member onto the spacer, to mount the second member over the first member so as to form a product;
(iii) heating the product obtained in Step (ii) at a first temperature that is lower than a second temperature at which the solvent in the nanometal paste is evaporated, to cause the spacer to melt or decompose;
(iv) after the heating of the product at the first temperature, evaporating the solvent in the nanometal paste by heating the product at the second temperature at which the solvent in the nanometal paste is evaporated; and
v) after the evaporating of the solvent, sintering the metal nanoparticles by heating the product at a third temperature at which the metal nanoparticles are sintered, the third temperature being higher than the first and second temperatures,
wherein the spacer has a wire shape or a foil shape.