US 12,257,648 B2
Laser processing device
Kazuhiro Yoshida, Tokyo (JP); Yoshinao Komatsu, Tokyo (JP); Saneyuki Goya, Tokyo (JP); Akiko Inoue, Tokyo (JP); Yasuyuki Fujiya, Tokyo (JP); Ryuichi Narita, Tokyo (JP); and Masahiko Shimizu, Tokyo (JP)
Assigned to MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo (JP)
Appl. No. 17/607,131
Filed by MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo (JP)
PCT Filed Jul. 31, 2019, PCT No. PCT/JP2019/029934
§ 371(c)(1), (2) Date Oct. 28, 2021,
PCT Pub. No. WO2021/019704, PCT Pub. Date Feb. 4, 2021.
Prior Publication US 2022/0203480 A1, Jun. 30, 2022
Int. Cl. B23K 26/364 (2014.01); B23K 26/14 (2014.01); B23K 26/142 (2014.01)
CPC B23K 26/364 (2015.10) [B23K 26/142 (2015.10); B23K 26/1464 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A laser processing device comprising:
a laser irradiation unit that forms a processing groove extending in a scanning direction on a workpiece by performing laser processing on the workpiece while scanning a surface of the workpiece; and
a nozzle unit that has a plurality of ejection holes aligned in the scanning direction to eject gas as an ejection flow toward the processing groove from each of the ejection holes, wherein
the nozzle unit has a plurality of suction holes,
the plurality of suction holes are provided along the scanning direction,
each of the plurality of suction holes is provided between each pair of adjacent ejection holes and which suctions a scavenging flow formed by reversing the ejection flows on a bottom surface of the processing groove,
a space is formed inside the nozzle unit, and
each of the plurality of ejection holes communicates with the space.