CPC B23K 10/003 (2013.01) [H01J 37/32541 (2013.01)] | 6 Claims |
1. A work processing apparatus configured to perform processing of a surface to be processed of a work by causing a processing head to come into sliding contact with the work held on an upper surface of a holding plate, the work processing apparatus comprising:
a processing head is provided to be rotatable and including a plasma electrode configured to generate plasma and radiate the plasma to the surface to be processed of the work,
wherein, in the plasma electrode, an annular or solid cylindrical central electrode provided at a center in a radial direction and an annular outer circumferential electrode provided at an outer side in the radial direction with respect to the central electrode are arranged with an annular slit portion intermediating therebetween at a boundary position thereof, the slit portion is configured as a plasma generation space, and a processing pad is provided at bottom surfaces of the central electrode and the outer circumferential electrode;
wherein the plasma electrode includes a projecting portion which projects in a direction to reduce a separation dimension of the slit portion at a lower end position in at least one of two side surfaces facing each other across the slit portion;
wherein the projecting portion is formed into a shape projecting with a mutually identical dimension at a lower end position in each of the two side surfaces; and
wherein regions not provided with the projecting portion in the side surfaces are formed with an insulating material.
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